On Monday, Chinese tech giant Huawei highlighted a new strategy for developing advanced semiconductors despite U.S. sanctions.
At the 2026 IEEE International Symposium on Circuits and Systems (ISCAS), He Tingbo from HUAWEI delivered a keynote speech titled “New Semiconductor Path in Practice”. She announced that the company will develop a new engineering method called “LogicFolding” for manufacturing its Kirin smartphone chips.
Tingbo noted, “We believe that openness and collaboration are key to driving ongoing progress in the semiconductor industry. No single company can independently find all the answers along the path of semiconductor evolution. With the τ Scaling Law, we look forward to working closely with scientists, engineers, and industry partners around the world to drive the sustainable development of the semiconductor and electronics industries.”
That breakthrough comes as Nvidia encounters U.S. export restrictions in China, and Apple faces renewed competition from Huawei in the world’s second-largest consumer market.
Huawei’s Mate 60 smartphone, released in 2023, features 5G connectivity enabled by a sophisticated chip, which helped the company regain market share from Apple.
Although U.S. restrictions have limited Nvidia from selling its top chips to China recently, Beijing has encouraged the growth of local technology. Last week, Nvidia CEO Jensen Huang said the company had “conceded” the Chinese market to Huawei.
By CEO NA Editorial Staff
