Syenta, an Australian semiconductor tech startup, announced on Tuesday that Pat Gelsinger, the former Intel CEO, will join its board of directors.
The company also confirmed it raised $26 million to develop a new manufacturing method aimed at easing ongoing artificial intelligence supply chain bottlenecks.
Gelsinger, now a venture capitalist at Playground Global stated that, besides enabling faster manufacturing, Syenta’s technology would also accelerate the connectivity on AI chips.
Syenta addresses the challenge of chip packaging with a unique method, described by CEO and co-founder Jekaterina Viktorova as akin to a stamp that electrochemically transfers copper wiring onto the base layer. This process reduces manufacturing steps by 40% and doesn’t require special tools, enabling a higher daily production of base layers.
“You open up a much bigger, more standardized, more available supply chain, yet with the density and performance,” Gelsinger said.
Along with the funding, the company announced it will open an office in Arizona, near the manufacturing facilities of Intel and Taiwan Semiconductor Manufacturing Co.
By CEO NA Editorial Staff
