The artificial-intelligence boom is pushing chip makers to speed up development of designs that allow chips to stack together like high-tech Lego pieces.
These chiplets offer an easier way to design more-powerful chips.
“A huge part of the future of semiconductors is packaging and chiplets,” said IBM head of research Darío Gil. “It’s just much more powerful than having to design a massive chip from scratch.”
Tech giants including AMD, Intel, Microsoft, Qualcomm, Samsung Electronics and Taiwan Semiconductor Manufacturing formed a coalition last year to create standards for designing uniform chiplets.
